Hanersun is committed to the continuous R & D and production process optimization of solar modules and has launched the 210 large wafer module and Topcon module. With the rapid change of technology, Hanersun still manages to provide customers with high-performance and high-quality solar products.

Technology Roadmap

  • 2007

    The R&D and application of SE cell technology promoted the average efficiency of solar cells in the industry

  • 2013

    Launched 5BB solar cell

  • 2015

    Making the efficiency of solar module exceed 19.5% for the first time

  • 2016

    The efficiency of PERC cell exceeded 20.5%

  • 2019

    Released the 158 PERC dual glass module
    Released the 1500V module
    Application development of high reflective busbar and EVA materials

  • 2020

    Released the 166 PERC bifacial module
    Combined the MBB high efficiency module with half-cut cell technology

  • 2021

    Released the HITOUCH 5 182mm half-cell module
    Released the HITOUCH 6 210mm half-cell module

  • 2022

    Released the HITOUCH 5N 182mm TOPCon module

  • 2023

    Released the HITOUCH 6N 210mm TOPCon module
    Released the HITOUCH 5A 182mm ABC module

  • 2024

    Release new heterojunction solar module

100+
solar patents

Up to 23.2%
module efficiency

Laboratories certified by CNAS, TUV, SUD, TÜV Rheinland and other authorities

30+ experienced
R & D engineers

Industry-leading
testing technology

New Tier1 Intelligent Factory

Hanersun also focuses on improving the automation and intelligence level of core module manufacturing process, and is committed to building a new tier 1 module intelligent factory with energy saving, high efficiency and full automation.

In 2023, Hanersun completed its comprehensive upgrade of the existing production lines, equipping them with TOPCon-compatible production equipment. With high precision, high yield, and fast switching advantages, the company has effectively improved capacity utilization and reduced production costs.

Process Optimization

Half-cell layering

High-density encapsulation

Non-destructive cutting

Multi busbar welding